Items	Method	Condition	Unit	Typical Value
Tg	2.4.24.4	DMA	℃	200
	2.4.24	TMA		175
Td	2.4.24.6	5% wt. loss	℃	390
T288	2.4.24.1	TMA	min	＞60
T260	2.4.24.1	TMA	min	＞60
Thermal Stress	2.4.13.1	288℃, solder dip	-	PASS
CTE (Z-axis)	2.4.24	Before Tg	ppm/℃	40
		After Tg	ppm/℃	230
		50-260℃	%	2.3
Dissipation Constant (1GHz)	2.5.5.9	C-24/23/50	-	3.47
Dissipation Factor (1GHz)	2.5.5.9	C-24/23/50	-	0.0083
Volume Resistivity	2.5.17.1	C-96/35/90	MΩ.cm	4.76×108
Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	1.84×107
Arc Resistance	2.5.1	D-48/50+D-0.5/23	s	181
Dielectric Breakdown	2.5.6	D-48/50+D-0.5/23	kV	＞45
Peel Strength (H Oz)	2.4.8	288℃/10s	N/mm	1.1
Flexural Strength (LW/CW)	2.4.4	A	MPa	510/490
Water Absorption	2.6.2.1	E-1/105+D-24/23	%	0.07
Flammability	UL94	C-48/23/50	Rating	V-0

Remarks:

1. All the typical value is based on the 1.0mm specimen, while the Tg is for specimen≥0.50mm, and the dielectric strength is based on other thickness specimen mentioned above.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.